| 摘要 |
PURPOSE: A variable directional microphone assembly and a semiconductor integrated circuit device are provided to prevent the inflow of a foreign material to a microphone through a sound hole by attaching a dustproof cloth in an outer side of a case. CONSTITUTION: A substrate(110) includes a hard printed circuit board(112), a printed circuit board(116) for mounting a microphone, and a connection unit(114). A semiconductor integrated circuit device is installed in the hard printed circuit board of the substrate. A microphone device(120-1,120-2) is installed in the printed circuit board for mounting the microphone. A cushion(122-1,122-2) is formed to protect the microphone device. The semiconductor integrated circuit device is formed on a mounting space(134) of a microphone body(130). A microphone device is formed in two mounting spaces of the microphone body. A case(140) fixes the assembly. The dustproof cloth(150) is attached to the outer side of the bottom of the case.
|
