INTERCONNECTION STRUCTURE AND ELECTRONIC DEVICE EMPLOYING THE SAME

摘要

PURPOSE: An interconnection structure and electronic device employing the same are provided to improve the degree of integration by reducing the sizes of the wirings. CONSTITUTION: The first connection pattern(25) is located in the level higher than the first, and second device (D1, D2). The upper connection pattern(40) is located in the level higher than the first, and second device. Therefore, and, the other device can be formed between the first device region (DR1) and the second device region (DR2). The width and the reduction of interval among upper wirings of upper wirings are minimized.