| 摘要 |
PURPOSE: A method for forming a via hole is provided to reduce plasma damage by physically forming a deep via hole by a micro tip. CONSTITUTION: A semiconductor chip(440) is prepared on a wafer(430). A board(410) is connected to a moving unit(405). At least one micro tip(420) is attached to the board. The board is formed with the size of the semiconductor chip unit. At least one micro tip is arranged on the semiconductor chip on a specific coordinate of the wafer. The board descends. At least one micro tip on a lower side of the board is contacted with the semiconductor chip. At least one micro tip physically drills the hole. A deep via hole is formed.
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