CURABLE RESIN COMPOSITION, HALOGEN-FREE RESIN SUBSTRATE, AND HALOGEN-FREE BUILD-UP PRINTED WIRING BOARD

摘要

PURPOSE: A curable resin composition for hole-plugging of a halogen-free resin substrate is provided to be suitable for a halogen free resin substrate with low load against environment and to manufacture a hole-plugging build-up printed wiring board with a stack via structure. CONSTITUTION: A curable resin composition comprises inorganic filler with an average particle diameter of 1 micron or less and the content of 50 weight% or less. The resin composition comprises a curing resin 40~80 weight% and hardener 1~10 weight%. The curing resin is an epoxy resin and provides a cured material with average linear expansion rate of 50 ppm/K or more in at least one direction.