| 摘要 |
The object of the invention is to provide a reflow Sn-plated copper alloy strip having improved fatigue characteristics by preventing the degradation of fatigue characteristics caused by reflow Sn plating. The invention provides a copper alloy strip having an Sn or Sn alloy plating film formed thereon by electroplating and reflowing treatment, wherein average hydrogen concentration in the strip being about 2 mass ppm or less. |
