CONTROL SYSTEM OF CHEMICAL MECHANICAL POLISHING EQUIPMENT AND METHOD FOR CONTROLLING POLISHING TIME THEREOF
摘要
PURPOSE: A control system of chemical mechanical polishing equipment and a method for controlling a polishing time thereof are provided to improve accuracy of a polishing time by correcting an error of the polishing time due to the deterioration of a component. CONSTITUTION: A sample logic unit(230) calculates a sample process time about the sample of a product. A main process logic unit(220) calculates a main process time about a current lot of the product by the sample process time. A correction logic unit(240) calculates the difference value of the polishing time due to the time interval of a feedback timing and the current timing. A process controller(210) controls the polishing time due to the deterioration of the component of the chemical mechanical polishing equipment by adding the main process time to the difference value.
申请公布号
KR20100007571(A)
申请公布日期
2010.01.22
申请号
KR20080068249
申请日期
2008.07.14
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
HAN, JOO CHEOL;KIM, HYOUNG GYUN;LEE, SEUNG MAHN;LEE, KI WOOK;LEE, SUNG BAE;HANG, DUK HO;KIM, DONG HUN;MOON, SUN HO