COMPOSITION, AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME

摘要

PURPOSE: An anisotropic conductive adhesive composition is provided to improve the wettability of the surface of conductive pattern, to impart excellent electrical characteristic to an electronic device, and to easily restore a damaged contact unit. CONSTITUTION: An anisotropic conductive adhesive composition comprises a low melting solder(136), a thermosetting polymer resin, and a curing agent of an anhydride-based material. The thermosetting polymer resin comprises a hydroxyl group and the low melting solder actuates as a curing catalyst. The composition further comprises a deforming agent for reducing the surface tension of the thermosetting polymer resin.