发明名称 INJECTION MOLDINGS, INJECTION-MOLDING APPARATUS AND METHOD THEREOF
摘要 <p>PURPOSE: An injection molding, an injection-molding device and a method thereof are provided to simply form a pattern of a micrometer size structure or a nanometer size structure. CONSTITUTION: A cavity mold(100) has a fused cavity. A core surface is arranged in a core mold(200). When the core mold and the cavity mold are coupled, a molding space is formed. Heating units(300) heat the cavity mold or the core mold. Cooling units(400) cool the cavity mold or the core mold. A pattern of a micrometer size structure or a nanometer size structure is formed in a patterning stamp(500). The patterning stamp is arranged in the inner surface of the molding space.</p>
申请公布号 KR20100007959(A) 申请公布日期 2010.01.22
申请号 KR20097025326 申请日期 2007.08.28
申请人 LG ELECTRONICS INC. 发明人 KIM, YOUNG BAE;YOON, HYUNG PYO;JEONG, SEOK JAE;JUN, HYUN WOO;JUNG, CHANG IL
分类号 B29C45/04;B29C45/14;B29C45/26;B29C45/73 主分类号 B29C45/04
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