发明名称 |
Micromechanical sensor element, method for manufacturing a micromechanical sensor element and method for operating a micromechanical sensor element |
摘要 |
A micromechanical sensor element includes: a substrate; a first seismic mass suspended from the substrate, which is deflectable from a first rest position by an acceleration acting perpendicularly to a main plane of extension; and a second seismic mass, which is deflectable from a second rest position by the acceleration. At least a partial overlap is provided between the first seismic mass and the second seismic mass perpendicular to the main plane of extension.
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申请公布号 |
US2010011860(A1) |
申请公布日期 |
2010.01.21 |
申请号 |
US20090459993 |
申请日期 |
2009.07.09 |
申请人 |
OFFENBERG MICHAEL;BAUS MICHAEL |
发明人 |
OFFENBERG MICHAEL;BAUS MICHAEL |
分类号 |
G01P15/125;G01P15/00;H01L21/00 |
主分类号 |
G01P15/125 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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