发明名称 Micromechanical sensor element, method for manufacturing a micromechanical sensor element and method for operating a micromechanical sensor element
摘要 A micromechanical sensor element includes: a substrate; a first seismic mass suspended from the substrate, which is deflectable from a first rest position by an acceleration acting perpendicularly to a main plane of extension; and a second seismic mass, which is deflectable from a second rest position by the acceleration. At least a partial overlap is provided between the first seismic mass and the second seismic mass perpendicular to the main plane of extension.
申请公布号 US2010011860(A1) 申请公布日期 2010.01.21
申请号 US20090459993 申请日期 2009.07.09
申请人 OFFENBERG MICHAEL;BAUS MICHAEL 发明人 OFFENBERG MICHAEL;BAUS MICHAEL
分类号 G01P15/125;G01P15/00;H01L21/00 主分类号 G01P15/125
代理机构 代理人
主权项
地址