| 发明名称 |
SPUTTER TARGET ASSEMBLY HAVING A LOW-TEMPERATURE HIGH-STRENGTH BOND |
| 摘要 |
Sputter target assemblies are disclosed, wherein the target and the backing plate are joined together through brazing at low temperatures to produce a superior bond between the target and the backing plate.
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| 申请公布号 |
US2010012488(A1) |
申请公布日期 |
2010.01.21 |
| 申请号 |
US20080173557 |
申请日期 |
2008.07.15 |
| 申请人 |
KOENIGSMANN HOLGER J;LO CHI-FUNG;GILMAN PAUL S |
发明人 |
KOENIGSMANN HOLGER J.;LO CHI-FUNG;GILMAN PAUL S. |
| 分类号 |
C23C14/00;B32B37/00 |
主分类号 |
C23C14/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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