| 摘要 |
An electronic component module comprising at least one ceramic circuit carrier (2, 3) and a cooling device with at least one heat sink (4), a bonding region arranged between the ceramic circuit carrier (2, 3) and the cooling device adapted for bonding the circuit carrier (2, 3) to the cooling device (4). The bonding region (5, 7; 6, 8) comprises a bonding layer comprised of metal and a eutectic region (7, 8).
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