| 摘要 |
PROBLEM TO BE SOLVED: To provide a laminated chip having a low-cost means for electric coupling between chips by a simple structure and process without requiring through-vias. SOLUTION: The laminated chip includes: a first chip having a plurality of first electrodes on one surface (front surface) of a substrate; and a second chip having a semiconductor element on the surface of the conductive substrate and second electrodes in positions corresponding to the first electrodes on the surface of the substrate. The first electrodes of the first chip are bonded to the other surface (rear surface) of the second chip to form a laminate. The first and second electrodes and an inner region of the substrate of the second chip sandwiched between the first and second electrodes are used as electric coupling means between the first and second chips. COPYRIGHT: (C)2010,JPO&INPIT |
