发明名称 FLEX-RIGID WIRING BOARD AND ELECTRONIC DEVICE
摘要 A flex-rigid wiring board including a flexible printed wiring board, a rigid printed wiring board, a first connection terminal formed over the rigid printed wiring board and positioned to be mounted onto a motherboard, and a second connection terminal formed over the rigid printed wiring board and positioned to mount an electronic component. The flexible printed wiring board has a first conductive layer, the rigid printed wiring board has a rigid base material, an insulation layer over the rigid base material and a second conductive layer formed over the insulation layer. The insulation layer covers at least a portion of the flexible printed wiring board and at least a portion of the rigid base material while exposing at least a portion of the flexible printed wiring board, and the first conductive layer and the second conductive layer are connected through a plated metallic layer penetrating through the insulation layer.
申请公布号 US2010014265(A1) 申请公布日期 2010.01.21
申请号 US20090489999 申请日期 2009.06.23
申请人 IBIDEN CO., LTD 发明人 SAGISAKA KATSUMI
分类号 H05K1/14;H05K1/00 主分类号 H05K1/14
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