发明名称 METHOD AND APPARATUS FOR PROCESSING WORKPIECE
摘要 The present invention is a processing method for applying predetermined processing to a workpiece with said workpiece mounted on a mounting stage arranged in a process chamber in a depressurized atmosphere, in which when no workpiece is mounted on the mounting stage, an inactive gas is discharged from at least a heat transfer gas supply hole of the mounting stage in the process chamber so that a gas layer is formed on a mounting surface of the mounting stage. The present invention is also a processing apparatus.
申请公布号 US2010015812(A1) 申请公布日期 2010.01.21
申请号 US20090567491 申请日期 2009.09.25
申请人 TOKYO ELECTRON LIMITED 发明人 NISHIKAWA HIROSHI
分类号 H01L21/31;C23F1/00;H01L21/00;H01L21/3065;H05H1/24 主分类号 H01L21/31
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