| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive layer-forming liquid which can inhibit the deterioration of adhesive layer-forming performance with the passage of time and can ensure the surface smoothness of the adhesive layer. SOLUTION: Provided is the adhesive layer-forming liquid for forming adhesive layers for the adhesion of copper to resins, characterized in that the adhesive layer-forming liquid is an aqueous solution comprising an acid, a stannic salt, a complexing agent, a stabilizer, and a complex-forming inhibitor for inhibiting the complex formation reaction of the complexing agent with the copper. COPYRIGHT: (C)2010,JPO&INPIT
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