| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a plating apparatus capable of suppressing physical stress to a wafer in the connection of an energization electrode to a base electrode. Ž<P>SOLUTION: The plating method has a cover 22 to adhere to a base electrode layer on a semiconductor substrate 31 and having an opening part 220, a solvent supply part 40 for supplying a solvent capable of dissolving an insulation film 33 on the base electrode layer to a region covered with the cover 22 to remove the insulation film 33 on the base electrode 32 covered with the cover 22 and the energization electrode 21 being contact with the base electrode 32 exposed by the removal of the insulation film 33 through the opening part 220. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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