| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a lamp that efficiently dissipates heat from a semiconductor light-emitting element such as an LED element being a light source. <P>SOLUTION: The lamp 1 includes a heat sink 5, a substrate 15 mounted on the heat sink 5, the LED element Dnm mounted on a principal surface of the substrate 15 on the opposite side from the heat sink 5, and a glass-made bulb 9 mounted on the heat sink 5 and covering the substrate 15 including the LED element Dnm. On an internal surface of the bulb 9, a light transparent layer 35 is formed of a light transparent material having higher thermal conductivity than the bulb 9, and part 35a of the light transparent layer 35 is connected to the heat sink 5 through a thermal conduction portion 37 made of a thermal conductive material having thermal conductivity equal to or higher than the thermal conductivity of the light transparent layer 35. <P>COPYRIGHT: (C)2010,JPO&INPIT |
