| 摘要 |
<P>PROBLEM TO BE SOLVED: To easily remove ruthenium films adhering on a substrate rear, a substrate bevel and an outer periphery by etching without a remainder. Ž<P>SOLUTION: Film-formation treatment such as ruthenium is conducted to the surface of a substrate 5, the substrate 5 is rotated while being held by rollers 4, the substrate 5 is held by U-shaped jigs 3 and an etchant is supplied from the upper section of the U-shaped jigs 3. Consequently, the ruthenium films adhering on the substrate rear, the substrate bevel and the outer periphery can easily be removed without the remainder. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
