| 摘要 |
The present invention relates to an optical module package for bidirectional communication in which a laser diode chip, a beam splitter, and a receiving photo diode chip are built into a single package housing to perform simultaneous transmission and reception of an optical signal, and in which the optical module has a wedge-type sub-mount on which the laser diode chip is mounted, wherein the sub-mount has a side surface with a wedge-type groove for coupling with the beam splitter. The optical module package for bidirectional communication according to the present invention has a laser diode chip (100), beam splitter (200), and receiving photo diode chip (400) built into a single package housing, wherein laser diode chip (100) is coupled onto sub-mount (300) which has one side surface with a wedge-type groove (310) such that the beam splitter (200) is fitted into the wedge-type groove (310), and the receiving photo diode chip (400) is arranged below the beam splitter (200) fitted into the wedge-type groove (310) of the sub-mount (300). |
