COMPOUND HAVING A PLURALITY OF TETRAPHENYLMETHANE BACKBONES, FILM-FORMING COMPOSITION, INSULATING FILM AND ELECTRONIC DEVICE

摘要

A compound represented by formula (1) and/or a film-forming composition containing at least one kind of polymer obtained by using the compound.  The compound is useful as a material having excellent heat resistance, and has a plurality of tetraphenylmethane backbones.  The film-forming composition contains the compound and is capable of forming a film having excellent characteristics such as high heat resistance, high mechanical strength and low dielectric constant.  An insulating film obtained by using the film-forming composition and an electronic device having the insulating film are also disclosed. (In formula (1), A represents a group represented by one of formulae (2-1)-(2-7) or a single bond; each X1 represents a group represented by formula (3); n represents an integer of 2-4; and X1's may be the same as or different from each other.)