VAPOR PHASE METHODS FOR FORMING ELECTRODES IN PHASE CHANGE MEMORY DEVICES

摘要

A method for forming electrode materials uniformly and conformally within openings having small dimensions, including sublithographic dimensions, or high aspect ratios. The method includes the steps of providing an insulator layer having an opening formed therein, and forming a conformal conductive or semiresistive material over and within the opening. The method is a CVD or ALD process for forming metal nitride, metal aluminum nitride, and metal silicon nitride electrode compositions. The methods utilize metal precursors containing one or more ligands selected from alkyl, allyl, alkene, alkyne, acyl, amide, amine, immine, imide, azide, hydrazine, silyl, alkylsilyl, silylamine, chelating, hydride, cyclic, carbocyclic, cyclopentadienyl, phosphine, carbonyl, or halide. Suitable precursors include monometallic precursors having the general formula MRn, where M is a metal, R designates a ligand as indicated above and n is an integer corresponding to the number of ligands bonded to the central metal atom. M may be Ti, Ta, W, Nb, Mo, Pt, Cr, Co, Ni, or other transition metal.