发明名称 ARRANGEMENT STRUCTURE OF WIRING BODY, MOBILE PHONE, AND WIRING COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a simple arrangement structure of a wiring body having waterproofness, and to provide a mobile phone using the arrangement structure, and an a wiring component. Ž<P>SOLUTION: An arrangement structure of a wiring body includes a heat shrinkage tube 5, and a wiring body insertion opening 11h provided in the housing 11 wherein a wiring body 3 passes through the heat shrinkage tube and the wiring body insertion opening, the heat shrinkage tube 5 is contracted and stuck to the wiring body, and the heat shrinkage tube thus stuck or a packing 17 which is stopped at the heat shrinkage tube is attached to the wiring body insertion opening 11h to come into contact therewith thus imparting waterproofness. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010016123(A) 申请公布日期 2010.01.21
申请号 JP20080173720 申请日期 2008.07.02
申请人 SUMITOMO ELECTRIC IND LTD 发明人 MISHIMA HIDEHIKO;KOYAMA KEIJI;BOKU TATSUTAMA
分类号 H05K7/00;H04M1/02;H05K5/06 主分类号 H05K7/00
代理机构 代理人
主权项
地址