发明名称 |
ARRANGEMENT STRUCTURE OF WIRING BODY, MOBILE PHONE, AND WIRING COMPONENT |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a simple arrangement structure of a wiring body having waterproofness, and to provide a mobile phone using the arrangement structure, and an a wiring component. Ž<P>SOLUTION: An arrangement structure of a wiring body includes a heat shrinkage tube 5, and a wiring body insertion opening 11h provided in the housing 11 wherein a wiring body 3 passes through the heat shrinkage tube and the wiring body insertion opening, the heat shrinkage tube 5 is contracted and stuck to the wiring body, and the heat shrinkage tube thus stuck or a packing 17 which is stopped at the heat shrinkage tube is attached to the wiring body insertion opening 11h to come into contact therewith thus imparting waterproofness. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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申请公布号 |
JP2010016123(A) |
申请公布日期 |
2010.01.21 |
申请号 |
JP20080173720 |
申请日期 |
2008.07.02 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
MISHIMA HIDEHIKO;KOYAMA KEIJI;BOKU TATSUTAMA |
分类号 |
H05K7/00;H04M1/02;H05K5/06 |
主分类号 |
H05K7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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