Semiconductor light emitting device and semiconductor light emitting device mounted board

摘要

In a semiconductor light emitting device having a matrix of a plurality of bumps composed of one n-bump formed on an n-electrode layer and of a large number of p-bumps formed on p-electrode layers, occurrence of faulty junction in the n-bump fewer than the p-bumps after mounting can be suppressed by placement of the n-bump at center of the bump array that is most resistant to occurrence of stress after the mounting. Employment of such a configuration of bump array increases reliability of mounting thereof while improving uniformity of light emission intensity in the semiconductor light emitting device having an increased size.