发明名称 |
PAPER CUP MANUFACTURE WITH MICROENCAPSULATED ADHESIVE |
摘要 |
Paper cup manufacture utilizing microencapsulated adhesive typically includes: (a) supplying a paperboard web to a coating line; (b) coating the web in the coating line with a liquid-resistant coating in a first predetermined pattern on a first side thereof corresponding to interior surfaces of sidewalls of paperboard cups formed from the paperboard blanks; (c) coating the web in the coating line with a microencapsulated adhesive in a second predetermined pattern corresponding to seams of paperboard cups formed from the paperboard blanks, the microencapsulated adhesive thereby being applied in common registry with the liquid-resistant coating in the coating line; and (d) cutting paperboard blanks from the web. The paperboard blanks are then (e) formed into the cup sidewall with the adhesive securing a seam.
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申请公布号 |
US2010012712(A1) |
申请公布日期 |
2010.01.21 |
申请号 |
US20090506814 |
申请日期 |
2009.07.21 |
申请人 |
DIXIE CONSUMER PRODUCTS LLC |
发明人 |
SWOBODA DEAN P.;VAN EYCK TIMOTHY L. |
分类号 |
B65D3/06;B31B1/62;B65D5/12 |
主分类号 |
B65D3/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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