SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device and a manufacturing method of the device.

SOLUTION: The semiconductor device 10 is provided with a semiconductor chip 11 having an electrode 11a and at least one electrode 11b which is not connected to an external electrode on a main face, a protection film 12 which is formed on a main face of the semiconductor chip 11 and has an opening 12b at an upper part of the electrode 11b, an insulating film 13 formed at an upper part of the protection film 12 and a wiring part (wiring 14 in Fig.1) which is formed outside a region of the opening 12b on the main face of the insulating film 13 and is electrically connected to the electrode 11a. Since the wiring part is not formed at an upper part of the opening 12b, high reliability can be obtained.

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