| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a device which peels a support plate off from a wafer to which the support plate is stuck without causing damage to a wafer. <P>SOLUTION: A peeling device 1 includes a suction plate 2 which sucks a support plate 6. The suction plate 2 has suction openings 3 and 3' which discharge gas between the suction plate 2 and the support plate 6, wherein diameters of the suction openings 3 and 3' are set between 0.3 mm and the outer circumferential diameter of the support plate 6. Consequently, the support plate 6 can be peeled off from the wafer 5 without causing damage to the wafer 5. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
