| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem that an ink dot is printed as an identification mark on a surface of a semiconductor element determined to be defective, but a size of the ink dot depends on an individual semiconductor element to be dotted and so the ink dot having a uniform size (area) can not be printed. Ž<P>SOLUTION: The problem is solved by a method of marking a semiconductor wafer including determining the position of the ink dot (steps 10, 30) and printing the ink dot. In determining the position of the ink dot (steps 10, 30), when there is the defective element among a plurality of semiconductor elements formed on the semiconductor wafer, a position off the element center is determined as the position of the ink dot if there is a factor of distorting the shape of the ink dot to be printed at the element center of the defective element. The ink dot is printed at the determined position. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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