发明名称 Semiconductor device with semi-insulating substrate portions
摘要 A semiconductor substrate includes semi-insulating portions beneath openings in a patterned hardmask film formed over a semiconductor substructure to a thickness sufficient to prevent charged particles from passing through the hardmask. The semi-insulating portions include charged particles and may extend deep into the semiconductor substrate and electrically insulate devices formed on opposed sides of the semi-insulating portions. The charged particles may advantageously be protons and further substrate portions covered by the patterned hardmask film are substantially free of the charged particles.
申请公布号 US2010013020(A1) 申请公布日期 2010.01.21
申请号 US20090586688 申请日期 2009.09.24
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD. 发明人 LIN WEN-CHIN;TANG DENNY;LEE CHUAN-YING;CHENG H. C.
分类号 H01L27/06;H01L29/06 主分类号 H01L27/06
代理机构 代理人
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