| 摘要 |
According to one embodiment, a printed wiring board comprises an insulating substrate having a mounting surface, a recognition mark formed on the mounting surface of the insulating substrate, and a plurality of reinforcing patterns formed on the mounting surface of the insulating substrate. The reinforcing patterns extend from an outer periphery of the recognition mark toward outside of the recognition mark and are arranged circumferentially at intervals relative to the recognition mark. Each of the reinforcing patterns has a width less than a width of a part of the outer periphery of the recognition mark connecting adjacent ones of the reinforcing patterns.
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