发明名称 |
Verfahren zum Verschalten aus einem Wafer gefertigter Halbleiterchips |
摘要 |
The method involves preparing a wafer (10), which is rotated around a rotation axis (R) during manufacturing or processing and has many unscattered semiconductor chips and successively arranging many grouping zones (21 to 24) in radial direction to which each section of the wafer is assigned. Each semiconductor chip of the wafer is partly assigned in the grouping areas, where two semiconductor chips, which are assigned to grouping zones, are connected. An independent claim is also included for a method for interconnecting semiconductor chips, which are manufactured on a common wafer. |
申请公布号 |
DE102006034599(B4) |
申请公布日期 |
2010.01.21 |
申请号 |
DE20061034599 |
申请日期 |
2006.07.26 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
WEIS, BENNO;PETERS, DETHARD;WOELZ, MARTIN |
分类号 |
H01L21/77;H01L21/60;H01L23/544 |
主分类号 |
H01L21/77 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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