发明名称 |
SEMICONDUCTOR DEVICE, PRODUCTION METHOD FOR THE SAME, AND SUBSTRATE |
摘要 |
A semiconductor device is provided in which a semiconductor chip is bonded to a substrate with a sufficiently increased bonding strength and cracking is assuredly prevented which may otherwise occur due to heat shock, heat cycle and the like. The semiconductor device includes a semiconductor chip and a substrate having a bonding area to which the semiconductor chip is bonded via a metal layer. The metal layer includes an Au-Sn-Ni alloy layer and a solder layer provided on the Au-Sn-Ni alloy layer. Undulations are formed in an interface between the Au-Sn-Ni alloy layer and the solder layer. |
申请公布号 |
US2010013095(A1) |
申请公布日期 |
2010.01.21 |
申请号 |
US20060064434 |
申请日期 |
2006.08.18 |
申请人 |
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发明人 |
HADA MOTOHARU;KASUYA YASUMASA;MATSUBARA HIROAKI |
分类号 |
H01L23/488;B23K31/02;H01L21/60 |
主分类号 |
H01L23/488 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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