UNIMORPH/BIMORPH PIEZOELECTRIC PACKAGE

摘要

A piezoelectric package (24) comprises upper and lower piezoelectric plates (26), each having opposing electrodes (30). The piezoelectric package further comprises an electrically insulative structure (32) encapsulating the piezoelectric plates. The package further comprises first and second external connectors (34) mounted to the insulative structure. The connectors respectively have connector terminals that are electrically coupled to the electrodes in different orders, and have geometric arrangements that are identical, such that a single interface device can be selectively mated to either of the connectors. A scalable piezoelectric package comprises a plurality of piezoelectric cells, each including a piezoelectric element and an external connector electrically coupled to the piezoelectric element of the respective piezoelectric cell. The piezoelectric package further comprises at least one intercellular conductor electrically coupling the piezoelectric cell together, such that the external connector of each of the piezoelectric cell is electrically coupled to the piezoelectric plate of each remaining piezoelectric plate of the piezoelectric cell.