| 摘要 |
<p>The present invention concerns a PCB for electronic devices and a method for manufacturing the same. That is to say, the method of manufacturing a PCB for use in electronic devices of the present invention comprises a step wherein a conducting film is bonded to a substrate with a bonding film, a step wherein the cutting lines of the pre-determined pattern are formed in order to form the pre-determined pattern in said conductive film and bonding film, and a step wherein the conductive film and bonding film outside of the pre-determined pattern are removed, leaving said fixed pattern.</p> |
