| 摘要 |
<P>PROBLEM TO BE SOLVED: To control bump collapse when piling bumps formed using metal nano-ink. <P>SOLUTION: A control portion of a die mounting device includes: a distance gaining means which gains a distance along a lowering direction of the collet 13 between a surface 24 on a side where a bump 23 of a semiconductor die 21 absorbed on a collet 13 is formed and a surface 34 on a side where a bump 33 of a substrate 31 is formed; and a piling means which releases absorption of the semiconductor die 21 of the collet 13 to pile the bump 23 of the semiconductor die 21 on the bump 33 of the substrate 31, after lowering the collet 13 towards the substrate 31 till the tip of the bump 23 of semiconductor die 21 absorbed on the collet 13 comes just above the tip of the bump 33 of the substrate 31, in response to a distance gained by the distance gaining means. <P>COPYRIGHT: (C)2010,JPO&INPIT |
