| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component mounting structure, capable of preventing various failures caused by thermal stresses, and reducing damages to an electronic component, and having a structure in which the electronic component is embedded into an insulating layer. <P>SOLUTION: The method of manufacturing the electronic component mounting structure includes the steps of: forming a first uncured resin layer 14 on a substrate 10 having a wiring pattern 12; disposing the electronic component 20 on the first uncured resin layer 14 with its connection pad 21a up; forming a second uncured resin layer 16, made of the same material as that of the first uncured resin layer 14, for coating the electronic component 20; performing heat treatment to cure the first and second uncured resin layers 14, 16 and obtaining an insulating layer 18 having the electronic component 20 embedded therein; and forming n layers (n: an integer equal to or larger than 1) of wiring patterns 12a, 12b electrically connected to the connection pad 21a of the electronic component 20 and the wiring pattern 12 on the substrate 10 through a via hole 18x bored in the insulating film 18. <P>COPYRIGHT: (C)2010,JPO&INPIT |
