| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an optical pickup device capable of maintaining an optimal position at a high positional accuracy without lowering a bonding strength even when a stress due to an external load by bending moment or circumstantial changes is caused to an optical part module, particularly in the case where the optical pickup device is thin. <P>SOLUTION: In the optical pickup device including the optical part module having a light-emitting device and an optical pickup case to which the optical part module is fixed by way of an adhesive, the optical part module is adhesively fixed by disposing a bonding surface of the optical part module to the optical pickup case at least at two positions on lateral surfaces of the optical part module putting an optical axis therebetween, and a bonding distance L in the lateral surface between the optical part module and the optical pickup is defined as: 40 μm < L < 570 μm. <P>COPYRIGHT: (C)2010,JPO&INPIT |
