| 发明名称 |
Image sensor module embedded in mobile phone and method of manufacturing the same |
| 摘要 |
Disclosed herein is an image sensor module embedded in a mobile phone and a method of manufacturing the same, in which a device is mounted on an image sensor chip to miniaturize the resulting product, thus enabling cost savings and enhancing product competitiveness.
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| 申请公布号 |
US2010013968(A1) |
申请公布日期 |
2010.01.21 |
| 申请号 |
US20080285783 |
申请日期 |
2008.10.14 |
| 申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
KIM YOUNG SHIN;YEOM SEUNG JAE |
| 分类号 |
H01L27/14;H04N5/225 |
主分类号 |
H01L27/14 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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