| 摘要 |
<p>Provided is a method for manufacturing a module having a built-in component, and by the method, a rate of failure products generated by troubles such as solder flush can be reduced. In the method for manufacturing the module having a built-in component, an electronic component (14) is prepared, and in a step of bonding a conductor section (13) with a terminal electrode (14A) formed on a lower surface of the electronic component (14), an electronic component (11) and the conductor section (13) are bonded so as to form a gap (d) between the lower surface of the electronic component (14) and an insulating layer (12), over the entire lower surface. In a fourth step of obtaining a resin layer (15) which covers the electronic component (14), uncured thermosetting resin is permitted to flow into the gap (d) so as to fully fill the gap (d) with the uncured thermosetting resin, and the resin layer (12) is formed.</p> |
