| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of grinding a wafer, preventing surface burning from occurring by improving a so-called biting to the wafer when the wafer ground by a rough grinding means is ground by a finishing grinding means. SOLUTION: A rough grinding step leaves the unground portion of the wafer 15 at the center by positioning the outer periphery of the grinding surface of a rough grinding wheel eccentrically from the center of the wafer 15 held by a chuck table 6. A finish grinding step includes a first finish grinding step and a second finish grinding step. In the first finish grinding step, the unground portion of the wafer is ground by positioning the grinding surface of a finish grinding wheel in such a manner as to pass through the center of the wafer 15 held by the chuck table 6. In the second finish grinding step performed following the first finish grinding step, all surfaces of the wafer 15 the unground portion of which is ground are ground. COPYRIGHT: (C)2010,JPO&INPIT
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