发明名称 AQUEOUS COATING AGENT FOR ELECTRONIC COMPONENT-PACKAGED SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To realize an aqueous coating agent for an electronic component-packaged substrate, which precludes generation of blistering referred to as popping on a coating surface. Ž<P>SOLUTION: The foaming generated on the coating surface can be reduced by adding 50-500 ppm by weight of aqueous fluorine-based aqueous oil repellent agent as a solid content to an aqueous coating agent 3 containing a thermoplastic elastomer as a main component and drying the electronic component-packaged substrate coated with the aqueous coating 3 at 100°C or higher for five minutes. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
申请公布号 JP2010013526(A) 申请公布日期 2010.01.21
申请号 JP20080173656 申请日期 2008.07.02
申请人 DENSO CORP 发明人 OKITA HIKARI;OBARA FUMIO
分类号 C09D121/00;C09D5/02;C09D7/12;C09D153/00;H01L23/29;H01L23/31 主分类号 C09D121/00
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