发明名称 SOLID STATE IMAGING DEVICE
摘要 A solid state imaging device includes: a light receiving portion; a transfer gate; a clock wiring group; and a substance. The light receiving portion includes a plurality of light receiving elements formed on a substrate. The charge transfer portion transfers electric charges supplied from the light receiving portion. The transfer gate is provided between the light receiving portion and the charge transfer portion and supplies the electric charges accumulated in the light receiving portion to the charge transfer portion. The clock wiring group includes a plurality of wirings and supplies a plurality of clocks for transferring the electric charges. The substance shields light with a wavelength lower than a predetermined wavelength. The plurality of wirings is arranged away from one another with a gap corresponding to the predetermined wavelength. The substance is arranged to cover the gap and shields light with a wavelength possibly passing through the gap.
申请公布号 US2010013967(A1) 申请公布日期 2010.01.21
申请号 US20090496050 申请日期 2009.07.01
申请人 NEC ELECTRONICS CORPORATION 发明人 TANAKA MAKOTO
分类号 H01L27/14;H01L27/148;H01L31/18;H04N5/335;H04N5/341;H04N5/359;H04N5/369;H04N5/3728;H04N5/376 主分类号 H01L27/14
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