发明名称 ARRANGEMENT STRUCTURE OF GUIDE CHIP FOR HIGH-FREQUENCY INDUCTION HEATING COIL
摘要 <p>An arrangement structure of guide chips for a high-frequency induction heating coil which can be relatively easily and inexpensively implemented, wherein the center of a journal portion or pin portion of a crankshaft can be correctly positioned and the journal or pin portion can be evenly heated by high-frequency induction heating to homogenize a hardening layer. A guide chip (21a) for a high-frequency induction heating coil on the upper side is fixedly attached to a side plate (7), while at least one of guide chips (21b, 21c) for a high-frequency induction heating coil on the right and left sides is so disposed as to be movable in the radial direction of a journal portion (2) or pin portion (4). The dimension between the guide chips (21b, 21c) for a high-frequency induction heating coil on the right and left sides is so set as to be smaller than the outer diameter of the journal portion (2) or pin portion (4) in a free state wherein none of the three guide chips (21a, 21b, 21c) for a high-frequency induction heating coil are in contact with the journal portion (2) or pin portion (4).</p>
申请公布号 WO2010007679(A1) 申请公布日期 2010.01.21
申请号 WO2008JP62892 申请日期 2008.07.17
申请人 DENKI KOGYO CO., LTD.;SAWATSUBASHI, SEIICHI 发明人 SAWATSUBASHI, SEIICHI
分类号 C21D9/30;C21D1/10;C21D1/42;H05B6/10 主分类号 C21D9/30
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