| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a protective film covering device with which a protective film covers a wafer surely and economically even when there is difference in level on the surface to be worked of a wafer and metal bump such as an electrode is arranged. <P>SOLUTION: This device is the protective film covering device 30 in which the protective film covers the surface of the wafer W and provided with a spinner table 48 with which the wafer W is sucked, held and rotated and an applying means for applying a liquid resin to the wafer W which is sucked and held on the spinner table 48. The applying means includes a spraying means 68 for jetting the liquid resin by making in spray, an arm 70 for supporting the spraying means 68 and an oscillating means 72 for oscillating the spraying means 68 supported with the arm 70 in the horizontal direction at least in the region from the center part of rotation of the wafer W to the outer peripheral part. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
