发明名称 |
METHODS FOR FORMING DENSE DIELECTRIC LAYER OVER POROUS DIELECTRICS |
摘要 |
Methods for forming a dense dielectric layer over the surface of an opening in a porous inter-layer dielectric having an ultra-low dielectric constant are disclosed. The disclosure provides methods for exposing the sidewall surface and the bottom surface of the opening to a plurality of substantially parallel ultra-violet (UV) radiation rays to form a dense dielectric layer having a substantially uniform thickness over both the sidewall surface and the bottom surface.
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申请公布号 |
US2010012858(A1) |
申请公布日期 |
2010.01.21 |
申请号 |
US20090569077 |
申请日期 |
2009.09.29 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DIMITRAKOPOULOS CHRISTOS D.;CHACE MARK S. |
分类号 |
B01J19/12 |
主分类号 |
B01J19/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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