CIRCUIT MATERIALS, CIRCUITS LAMINATES, AND METHOD OF MANUFACTURE THEREOF
摘要
<p>A circuit substrate laminate, comprising a conductive metal layer; and a dielectric composite material having a dielectric constant of less than about 3.5 and a dissipation factor of less than about 0.006, wherein the dielectric composite material comprises: a polymer resin; and about 10 to about 70 volume percent of cenospheres having a ferric oxide content of less than or equal to 3 weight percent.</p>
申请公布号
WO2010009381(A1)
申请公布日期
2010.01.21
申请号
WO2009US50968
申请日期
2009.07.17
申请人
WORLD PROPERTIES, INC.;PAUL, SANKAR;CAISSE, CHRISTOPHER, J.;BAARS, DIRK, M.;HORN, ALLEN, F.
发明人
PAUL, SANKAR;CAISSE, CHRISTOPHER, J.;BAARS, DIRK, M.;HORN, ALLEN, F.