| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board and a method of manufacturing the same, wherein a heat radiation layer is selectively interposed inside a circuit board so that a high heat radiation effect and bending rigidity are provided, for achieving a reliable electrical connection between the heat radiation layer and a circuit pattern for improved heat radiation effect, with the heat radiation layer being usable as a power supply layer or a ground layer. SOLUTION: The method of manufacturing a printed circuit board includes a step of forming a circuit board by stacking a plurality of insulating layers so that a heat radiation layer is selectively interposed among a plurality of insulating layers bearing a circuit pattern on its surface, a step of forming a through-hole that penetrates one surface and the other surface of the circuit board, a step of forming a seed layer on the inner wall of the through-hole by Cu direct plating, and a step of forming a plated layer on the inner wall of the through-hole by performing electrolytic plating with the seed layer as an electrode. COPYRIGHT: (C)2010,JPO&INPIT |
