EPOXY-BASED COMPOSITION, ADHESIVE FILM, DICING DIE-BONDING FILM AND SEMICONDUCTOR DEVICE

摘要

The present invention relates to an epoxy-based composition, an adhesive film, a dicing die-bonding film and a semiconductor device employing the same. More specifically, it relates to an epoxy-based composition having a gel content of from 5% to 20% when measured under specific conditions and to an application therefor. The epoxy-based composition according to the present invention can minimise the incidence of burrs during processing while at the same time exhibiting outstanding high-temperature adhesive properties and displaying superior resilience characteristics even when a low glass-transition temperature is set when it is made into an adhesive. Consequently, when the present invention is employed, it can prevent die-pushing defects during high-temperature wire bonding or moulding processing, and it allows the production of outstandingly reliable semiconductor devices due to the superior adhesiveness and workability of the adhesive.