| 摘要 |
A device for cooling components comprises - a substrate (2) equipped with at least one component (3) to be cooled, - a cooling volume (5), which is directly adjacent to the substrate (2) and arranged on the side facing away from the component (3), the volume being provided for the conveyance of a cooling fluid, and - a reinforcement structure (7), which is arranged on the side of the substrate (2) equipped with the at least one component (3), and which is configured in order to counteract the bending of the substrate (2) caused by the pressure of the cooling fluid. |
