| 摘要 |
PROBLEM TO BE SOLVED: To fully cool down a guard ring while preventing lifting and damage of the guard ring. SOLUTION: A wafer support device 20 includes an electrostatic chuck 22 capable of adsorbing a silicon wafer W as an object of plasma processing, a guard ring 30 mounted on a step 26 of the electrostatic chuck 22, a cooling plate 40 placed on a backside of the electrostatic chuck 22 for cooling the electrostatic chuck 22, and a coolant gas flow path 50 arranged to supply a flow of coolant gas for cooling the guard ring 30. The guard ring 30 has a skirt 34 arranged to cover over a side face of the electrostatic chuck 22. The coolant gas flow path 50 is formed to make the coolant gas flow from a backside of the cooling plate 40 through an outer circumferential area 48 of an adhesive sheet 47 to be spread over and collide against a whole circumference on an inner wall of the skirt 34 of the guard ring 30. COPYRIGHT: (C)2010,JPO&INPIT |
