| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce a load of an operator, and to acquire proper creep rupture measurement data, by detecting a soldered portion subjected to a creep rupture test of a printed board for the test, and by executing automatically the creep rupture test. Ž<P>SOLUTION: A solder shape is measured beforehand, and the soldered portion which is an inspection object is discriminated automatically, and elongation of the soldered portion is measured by a load control mechanism placed on an X-Y moving mechanism, while applying a prescribed load onto a component soldered on the printed board for the test. Continuity between a plurality of terminals is monitored, and when some continuity is lost, it is determined that a rupture occurs, and an applied load, and an elongation, a time and a rupture mode until reaching rupture are preserved as data. The rupture mode, such as a solder rupture or a through-hole rupture, is determined by presence/absence of continuity between the plurality of terminals. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
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